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Waterproof TYPE C process features
- Categories:Industry News
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- Time of issue:2022-12-12
(Summary description)SB data cable is used for connection and communication between computer and external devices, and can also be used for charging mobile phones and connecting with the outside world. In layman's terms, it is used for data transmission and charging. Waterproof TYPE C products have the following characteristics.
Waterproof TYPE C process features
(Summary description)SB data cable is used for connection and communication between computer and external devices, and can also be used for charging mobile phones and connecting with the outside world. In layman's terms, it is used for data transmission and charging. Waterproof TYPE C products have the following characteristics.
- Categories:Industry News
- Time of issue:2022-12-12
- Views:
SB data cable is used for connection and communication between computer and external devices, and can also be used for charging mobile phones and connecting with the outside world. In layman's terms, it is used for data transmission and charging. Waterproof TYPE C products have the following characteristics:
1. The data transmission speed reaches 10Gbit/s, which is also the standard of USB3.1;
2. The size of the Type-C interface socket is about 8.3mm×2.5mm, and the design is slim;
3. It supports the "positive and negative plugging" function, can be inserted from both sides, and can withstand 10,000 times of repeated plugging and unplugging;
4. The waterproof TYPE C is equipped with standard specification cables. The Type-C connector can pass 3A current, and also supports "USBPD" that exceeds the existing USB power supply capacity, which can provide 100W of power. The Type-C connector is suitable for various ultra-thin tablets, mobile phones, two-in-one and other special-purpose mobile devices, and will become a connector that can meet the functions of data transmission, charging, etc. Standard image transmission. However, most of the existing USB Type-C data cables are round bar cables, and the transmission effect is not as good as the Type-C data cables made of FPC soft boards.
Most manufacturers of waterproof TYPE C for consumer electronics products are mounted on rigid boards or soft-hard boards. Traditional rigid boards are inflexible and inconvenient to use; although the rigid-flexible board has the load-bearing capacity of a rigid board and the flexibility of a flexible board, its production process is complicated, requiring both FPC production equipment and PCB production equipment, making production difficult, with a yield rate of only about 70%, large material waste, long production cycle, and expensive price. Flexible FPC circuit boards are high-reliability flexible printed circuit boards made of polyimide or polyester film as substrates. They have the characteristics of high wiring density, light weight, thin thickness, and good bendability. The board material of the flexible circuit board is too soft and has poor ability to carry electronic components. In the early days, it was not capable of carrying a Type-C interface, so the promotion was not particularly smooth. However, with the surge in demand for HUBs, supporting cable products are urgently needed. Recently, many companies have overcome this process difficulty and made FPC data cables that can be used with USB3.1 data cables with Type-C interfaces.
Due to its advantages in high-frequency transmission, waterproof TYPE C pays more attention to electromagnetic compatibility design during the production process. There is an electromagnetic compatibility pad in the middle of the product's tongue. One of its functions is to make the product use environment achieve the EMC effect. The common practice in the market is to connect the designed pins of EMCPAD to the outer iron shell through the pad to form a circuit. This structure has the following disadvantages: EMCPAD is combined with plastic through insert molding, and the pins are slender columns. During the Insertmolding process, burrs are easy to appear at the sealing position of EMCPADpins; the longitudinal length is relatively long and perpendicular to the opening and closing direction of the mold, which makes it difficult to position it in the mold, or there is a risk of skewness or being crushed by the mold during placement, which is not conducive to the realization of the automated manufacturing process and does not support the automatic pulling process of the injection mold; in addition, the pins also take up space on the customer's PCB, and solder holes need to be reserved, which poses a risk of poor spacing.






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